印制电路板（单/双/多层）Printed Circuit Boards

贴体包装可以将整叠电路板紧紧包装在底层气泡膜和上层真空膜之间，具有以下显著优点：

By skin packaging, the PCB stacks can be tightly packed between a lower air bubble sheet and upper clear plastic, offering the following advantages:

1.       Several stacks of PCB can be packed at one time for increase productivity.

2.       The PCB stacks are totally immobilized, offering scratch proof.

3.       Vacuum packaging can protect the products from dust and moisture for a longer product life.

4.       Crystal clear visual display can boost product appearance and value.